Polyimide Adhesive Tape 33M/Roll High Temperature Heat Resistant Electronic Insulation for BGA PCB 3D Printing Board Protection

Intro

Polyimide Adhesive Tape comes on a 33-meter roll, delivering reliable high-temperature insulation for sensitive electronics. Its polyimide film and adhesive formulation are built for masking, protection, and separation during BGA rework, PCB assembly, and 3D printing processes, helping you manage heat exposure without compromising component integrity.

List of Features

• Withstand elevated heat during soldering and rework, protecting copper traces and pads from thermal stress.
• Polyimide film delivers excellent dielectric strength and dimensional stability under heat, reducing risk of shorts and delamination.
• 33 meters per roll provides extended coverage for multiple boards and long projects, improving efficiency and reducing replenishment.
• Suitable for BGA masking, electronics insulation, and protective barriers in 3D printing or rapid prototyping setups.
• Thin, flexible film conforms to uneven surfaces and edges for precise masking without tearing.